Akita Elpida Memory Develops Thinnest MCP With 20 Stacked Dies

Akita Elpida Memory announced the development of a 1.4-mm thick Multi Chip Package with 20 stacked dies, making it the world's thinnest.

Its operations beginning in October of last year, Akita Elpida is a new company established in July, 2006 by Elpida Memory, with a business scope focusing on semiconductor back-end processes. Akita Elpida is currently applying its high-level technical strengths and manufacturing know-how it has developed as a member of the Hitachi group, as it currently focuses on developing and manufacturing cutting-edge, highly value-added packages known as MCPs and Package-on-Packages (PoPs), centering on products with 2 or 3 stacked dies.

Akita Elpida's technical skills which lead to the development of the world's thinnest package are introduced in the following process sequence:

1. Grinding technology to achieve 30 µm thick chips
2. Handling technology for 30 µm thick wafers
3. Technology for picking up and die-attaching 30 µm thick chips
4. 40 µm low loop wire bonding technology
5. Overhang wire bonding technology
6. Technology for injecting resin into narrow gap

Akita Elpida, plans from now on to put this package technology to work to establish high-yield and low-cost manufacturing technology for multi-chip stacked packages such as existing 5- and 7-die multi-chip stacked packages.

Source: Elpida Memory

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