Samsung Develops 1/4-inch 3-megapixel CMOS Image Sensor For Ultra Slim Camera Phones
Samsung Electronics announced its first 3-megapixel CMOS image sensor with a 1/4-inch lens aperture that is well suited for ultra slim camera phones.
According to the press release, Samsung's new 1.75um-size pixel enables the 1/4-inch lens aperture to reduce the camera module size by 30 percent as opposed to a conventional 2.25um pixel 1/3-inch lens aperture 3M-pixel CIS. The small form factor allows the 1.75um-pixel, 1/4-inch lens aperture 3M-pixel CIS to immediately replace a 1/4-inch lens aperture 2M-pixel CIS module, as it shares the same physical measurements with the new 3M-pixel CIS.
The 1.75um pixel, 1/4-inch lens aperture 3M-pixel CIS shows no degrading in the picture quality compared to a 2.25um pixel, 1/3-inch lens aperture 3M-pixel CIS.
By utilizing 90-nanometer process technology, Samsung expects to mass produce the new 1.75um pixel, 1/4-inch lens aperture 3-Mp CIS in the first quarter of 2007. The new CIS chip uses Samsung's proprietary 90nm copper technology that reduces the distance between the micro-lens to the photo diode thereby resulting in maximizing the light-gathering efficiency to overcome the potential decline of image quality as the pixel size scales down.
Source: Samsung Electronics
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