iXBT Labs - Computer Hardware in Detail

Platform

Video

Multimedia

Mobile

Other

Latest News


 « Previous Day News Archive  

Infineon Introduces Test Chip To Eliminate VIA Defects

Infineon has become the first semiconductor manufacturer in the world to introduce a method that can avoid one of the most common causes of defects in the production of highly integrated semiconductor circuits: the electrical failure of VIA contacts. "VIA" stands for "vertical interconnect" and refers to the contact between two metal layers in integrated circuits. Infineon developed the new method in collaboration with the Regensburg University of Applied Sciences (FH Regensburg) as part of its Automotive Excellence program, launched some three years ago to meet the automotive industry’s exacting quality requirements.

Today's integrated circuits contain millions of transistors that are interconnected by several layers of metal wiring. The components known as “VIAs” connect the metal conductors between the layers. They are extraordinarily small: A VIA, manufactured according to 0.13µm technology has diameter of just 200 nanometers, which makes it about 300 times thinner than a human hair. A modern microcontroller of around half a square centimeter in size contains well in excess of ten million VIAs. There is no possibility to optically or electronically control or measure the quality of a VIA during the manufacturing process. Electrical failure of a single VIA can, in the most extreme case, impair the functionality of the entire microcontroller, causing suboptimal performance, even in applications that are critical to safety.

The VIA array test chip is typical of the holistic methodology employed by Infineon in the Automotive Excellence program. Infineon is the first semiconductor manufacturer in the world to develop a method that can reliably identify potential VIA failures with high probability. The findings clearly locate the corresponding sources of defects in the production chain and eliminate or circumvent them from the outset. The VIA test chip allows Infineon to reduce its VIA defects by a factor of around 10.

The test chip maps an arrangement of more than half a million VIA cells, with each cell containing both the VIA to be evaluated and the associated control electronics. The electrical resistance and voltage drop are measured and then used as parameters to establish whether a VIA is defective, and, if so, where the source of the defect lies.

Infineon is currently using the VIA test chip primarily for components being manufactured in 0.5µm and 130-nanometer technology, e.g. the AUDO NG microcontroller, which uses 130-nanometer embedded flash technology. Infineon is confident that the VIA test chip will also be suitable for future technologies such as 90 and 65 nanometers.

Source: Infineon

 « Previous Day News Archive  

Latest headlines


ASUS Launches R9 200, R7 200 Series, Matrix R9 280X Graphics Cards

Apacer Launches SATA SLC-lite SSD solutions

ADATA Introduces a Stylish External HDD HC630

Samsung Introduces New Wireless Multiroom Speakers

WD Gives Consumers a Cloud of Their Own


Write a comment below. No registration needed!




blog comments powered by Disqus

  Most Popular Reviews More    RSS  

AMD Phenom II X4 955, Phenom II X4 960T, Phenom II X6 1075T, and Intel Pentium G2120, Core i3-3220, Core i5-3330 Processors

Comparing old, cheap solutions from AMD with new, budget offerings from Intel.
February 1, 2013 · Processor Roundups

Inno3D GeForce GTX 670 iChill, Inno3D GeForce GTX 660 Ti Graphics Cards

A couple of mid-range adapters with original cooling systems.
January 30, 2013 · Video cards: NVIDIA GPUs

Creative Sound Blaster X-Fi Surround 5.1

An external X-Fi solution in tests.
September 9, 2008 · Sound Cards

AMD FX-8350 Processor

The first worthwhile Piledriver CPU.
September 11, 2012 · Processors: AMD

Consumed Power, Energy Consumption: Ivy Bridge vs. Sandy Bridge

Trying out the new method.
September 18, 2012 · Processors: Intel
  Latest Reviews More    RSS  

i3DSpeed, September 2013

Retested all graphics cards with the new drivers.
Oct 18, 2013 · 3Digests

i3DSpeed, August 2013

Added new benchmarks: BioShock Infinite and Metro: Last Light.
Sep 06, 2013 · 3Digests

i3DSpeed, July 2013

Added the test results of NVIDIA GeForce GTX 760 and AMD Radeon HD 7730.
Aug 05, 2013 · 3Digests

Gainward GeForce GTX 650 Ti BOOST 2GB Golden Sample Graphics Card

An excellent hybrid of GeForce GTX 650 Ti and GeForce GTX 660.
Jun 24, 2013 · Video cards: NVIDIA GPUs

i3DSpeed, May 2013

Added the test results of NVIDIA GeForce GTX 770/780.
Jun 03, 2013 · 3Digests
  Latest News More    RSS  

Platform  ·  Video  ·  Multimedia  ·  Mobile  ·  Other  ||  About us & Privacy policy  ·  Twitter  ·  Facebook


Copyright © Byrds Research & Publishing, Ltd., 1997–2011. All rights reserved.