Micron Launches Multichip Package Line
Micron Technology announced its new line of multichip package (MCP) memory for use in feature-rich mobile phones. By combining Micron's NAND flash memory with its Mobile DRAM featuring Endur-IC technology in the same package, designers now have a convenient option to include quality Micron memory direct from the company into their high-performance handset designs.
Micron will showcase its new MCP and mobile memory portfolio at the 3GSM World Congress, held February 13 – 16, 2006 in Barcelona, Spain. A variety of Micron image sensor and mobile memory product demonstrations will take place at its booth on the exhibit floor in hall one, space C66.
Micron's high-density NAND and Mobile DRAM MCP devices are currently sampling to select customers and are expected to be available in 1Gb NAND/512Mb Mobile DDR DRAM configurations for production in Q4 2006.
Source: Micron Technology
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