Intel Opens 65nm, 300mm High-Volume Wafer Manufacturing Facility In Arizona

Intel has re-opened an advanced, high-volume semiconductor manufacturing facility in Chandler, Ariz., converting it to a 300mm, 65nm process factory. Called Fab 12, the factory is Intel’s second volume-production fab using 65nm process technology produced on the 300mm. It is also company's most technologically advanced, high-volume semiconductor manufacturing plant building multi-core microprocessors.

The Fab 12 conversion project, which began in 2004 and cost roughly $2 billion, was completed in approximately 18 months. Fab 12 is Intel’s fifth fab using 300mm wafers. Intel’s other facilities that manufacture using 300mm wafers are Fab 11X in New Mexico, D1D and D1C in Oregon, and Fab 24 in Ireland.

Fab 12’s re-opening is the latest in a string of six Intel announcements regarding re-investment in its U.S. manufacturing sites. In total, the announcements made in 2005 reflect a combination of more than $4 billion of new U.S.-based manufacturing expansion announced this year and completion of this $2 billion investment announced in 2004. These investments will add over 2,000 jobs (not including construction jobs).

Source: Intel

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