Intel Opens 65nm, 300mm High-Volume Wafer Manufacturing Facility In Arizona
Intel has re-opened an advanced, high-volume semiconductor manufacturing facility in Chandler, Ariz., converting it to a 300mm, 65nm process factory. Called Fab 12, the factory is Intelís second volume-production fab using 65nm process technology produced on the 300mm. It is also company's most technologically advanced, high-volume semiconductor manufacturing plant building multi-core microprocessors.
The Fab 12 conversion project, which began in 2004 and cost roughly $2 billion, was completed in approximately 18 months. Fab 12 is Intelís fifth fab using 300mm wafers. Intelís other facilities that manufacture using 300mm wafers are Fab 11X in New Mexico, D1D and D1C in Oregon, and Fab 24 in Ireland.
Fab 12ís re-opening is the latest in a string of six Intel announcements regarding re-investment in its U.S. manufacturing sites. In total, the announcements made in 2005 reflect a combination of more than $4 billion of new U.S.-based manufacturing expansion announced this year and completion of this $2 billion investment announced in 2004. These investments will add over 2,000 jobs (not including construction jobs).
ASUS Launches R9 200, R7 200 Series, Matrix R9 280X Graphics Cards
Apacer Launches SATA SLC-lite SSD solutions
ADATA Introduces a Stylish External HDD HC630
Samsung Introduces New Wireless Multiroom Speakers
WD Gives Consumers a Cloud of Their Own
Write a comment below. No registration needed!