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Texas Instruments Announce SmartReflex Technologies For 65nm Process

Texas Instruments Incorporated announced its SmartReflex power and performance management technologies for advanced mobile devices. TI's SmartReflex technologies are a combination of intelligent and adaptive silicon, circuit design and software designed to solve power and performance management challenges at smaller process nodes.

TI's SmartReflex technologies are claimed to solve the critical issue of leakage power in 65nm for mobile devices. Specifically, TI's SmartReflex technologies incorporate a system-level approach, from integrated circuit design to system software that guarantees performance while aggressively addressing the power consumption challenge for mobile devices at deep sub-micron process nodes. Leveraging TI's power management-focused silicon IP, System on Chip (SoC) design, and system software, SmartReflex technologies extend to the entire SoC and dynamically control voltage, frequency and power based on device activity, modes of operation and process and temperature variation.

TI first introduced technology elements of SmartReflex technologies at the 90nm process node and is now applying advanced techniques of the solution to 65nm. TI is incorporating the technology in its family of OMAPTM 2 applications processors and has plans to introduce incrementally more advanced SmartReflex technologies in future generations of wireless products.

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