Oki introduces X CooL heat dissipating material
Oki Electric introduced the new lightweight and flexible material X CooL that can be used to dissipate heat from electronic components. According to Oki, the novelty is able to reduce heat emission by 40% without fans.
A usual heatsink and X CooL
X CooL differs from usual heatsinks by special coating and small size that enables to use it in "dead zones" inside barebones, etc.
The novelty has form of a cube filled with Stick-it Flexible Hybrid Sheets made of non-organic paint and ceramics Cerac that has been developed by Oki together with Ceramission Co. The flexible "fins" are just 0.2mm thick, and the entire solution weighs just 1/8 of a usual heatsink weight.
X CooL is expected in the market from April 2005 on.
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