Intel stands up for lead-free chips
Intel informed on plans to reduce the amount of lead in its chips by 95% starting this year. Though no specific dates were disclosed.
According to the press release, some of these "lead-free" processors will be shipping in Q3 2004, while some of the embedded processors are to be shipped in Q2 2004.
In particular, the initiative is focused on not using lead on CPU package pins and reduce its amount between the core and the package.
The first lead-free package, Plastic Ball Grid Array was introduced as far back as in 2001 for flash memory, while the first solutions in such packages became available in 2002 having copper-tin-silver alloy instead of tin and lead.
But the Flip Chip Ball Grid Array still has 0.02g of lead, as the industry has yet to certify a reliable replacement.
ASUS Launches R9 200, R7 200 Series, Matrix R9 280X Graphics Cards
Apacer Launches SATA SLC-lite SSD solutions
ADATA Introduces a Stylish External HDD HC630
Samsung Introduces New Wireless Multiroom Speakers
WD Gives Consumers a Cloud of Their Own
Write a comment below. No registration needed!