Hynix launches volume production of 0.11µm 256Mbit chips
Semiconductor launched volume production of 0.11µm 256Mbit DDR SDRAM chips. For this the company improved the existing line that firstly reduced additional expenditures and secondly boosted line performance by 40%. Farhad Tabrizi, vice president of worldwide marketing, reported some time ago that the company would launch a line for 12" wafers next year.
By the way, Chinese Economic Daily News reported that Hynix would pass a part of its production to Chinese GSMC (Grace Semiconductor Manufacturing Corporation). They said Hynix was planning to outsource 0.11µm DRAM manufacture, however the agreements might be officially signed only next year.
GSMC launched the production of 0.11µm chips at one of its two Shanghai fabs last April. By the year-end the performance should make 10,000 of 200mm wafers monthly. In the future both fabs might be re-equipped for 300mm materials.
It seems that volume production using the new technologies and interesting third parties indicate that Hynix plans to struggle for its market share and return to the 3rd place in the manufacturer rating.
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