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Samsung offers new 6-chip MCP memory "pie"

Korean Samsung Electronics introduced its new MCP development 6-chip memory solution designed for mobile handsets and other similar devices.

This time the "pie" consists of 256Mbit NAND Flash, 128Mbit NOR Flash, 64Mbit UtRAM, 16Mbit SRAM and 2 x 128Mbit mobile DRAM. As far back as in March the company released two MCP chips for 3G devices:

  • RRNU6412864 2 x 64Mbit NOR Flash, 128Mbit NAND Flash and 64Mbit UtRAM
  • NUUS128643208 128Mbit NAND Flash, 64Mbit UtRAM, 32Mbit UtRAM and 8Mbit SRAM

The above solutions were 1.4mm thick that was just 0.2mm over usual chips. However the company optimized the layout and actually reduced MCP design by 50%.

New chips are even smaller — 10.5x10.0x1.2mm.

Finally here´s a legend for the photo above:

  1. UtRAM, data buffer
  2. mobile DRAM, primary and buffer memory
  3. NAND Flash, application data storage
  4. mobile DRAM, primary and buffer memory
  5. NOR Flash, instructions storage
  6. SRAM, data buffer

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