New litho platform from Canon
According to industry sources, Canon plans to announce a new exposure tool line.
Among novelties is the FPA-6000 platform supporting and 157 nm Canon tools. 248 nm, 193 nm FPA-6000 based systems are already being shipped.
New 193 nm AS4 tool features NA:0.85 optics, that enables to produce 0.09-micron and smaller chips. Another tool — 248 nm ES5 — has NA:0.80 optics, providing 110 nm chip production. The tools also feature a 500-mm/second, single-stage platform, which is said to have a throughput of 140 300-mm wafers an hour and 170 200-mm per hour.
According to Canon, 157 nm tools will be shipped early in 2005. One of the first customers for the tool is Germany´s Infineon Technologies AG.
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