EPOC: new Kingston´s proprietary package technology for memory modules

According to the EPOC technology, DRAM chips are mounted in different packages in two overlapping rows on the printed circuit board. The top tier is a row of raised Thin-Small Outline Package (TSOP) memory chips, and the lower tier is a row of smaller Chip Scale Package (CSP) memory chips. There are no chip-level interconnects or physical contact between the two overlapping rows. This enables airflow in-between the top and bottom chip rows for more effective heat dissipation.

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