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256 Mbit Mobile-RAM chips from Infineon

Infineon Technologies announced volume production of low-power 256 Mbit Mobile-RAM chips. Due to halving chip size and reducing its energy consumption comparing to usual SDRAM, Infineon positions Mobile-RAM for PDA, smartphones, Web tablets and digital cameras. Currently Mobile-RAM chips feature 128 and 256 Mbit capacity. Due to CSP (Chip-Scale-Package) chip size is 8x12 mm. They also feature FBGA (Fine-pitch Ball Grid Array) package.

Unlike usual SDRAM with 3.3 V supply voltage, Mobile-RAM requires 2.5 V (core) and 1.8 / 2.5 V (I/O). TCSR (Temperature Compensated Self Refresh) and PASR (Partial Array Self Refresh) enable to considerably reduce energy consumption.

In the near future Infineon plans to present 512 Mbit Mobile-RAM samples. Volume shipments of 256 Mbit Mobile-RAM chips have already started, wholesale price makes $15 per unit.

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