Intel launches Fab 11X in Rio Rancho
According to the schedule, Intel announced the grand opening of new Fab 11X in Rio Rancho, N.M. for making semiconductor products on 300-mm wafers. $2 billion fab is initially built for 300-mm volume production using 0.13-micron process technology. In 2003 Fab 11X is planned to transit to 0.09-micron process.
The Fab size is over 1 million square feet in size. Clean room space makes about 200,000 square feet.
According to Intel, the company has at least 6 fabs for 300-mm production. The first D1C- is in Hillsboro, Ore. After Fab 11x Intel plans to launch 300-mm production at Fab 24 in Leixlip, Ireland in H2 2003. This fab will be the first to make 0.09-micron chips. Another fab in Chandler, Arizona, was re-equipped from 8-inch to 300-mm wafers. D1D located in Hillsboro near D1C, will also make chips from 300-mm wafers simultaneously with transition to 0.07-micron. The sixth is the $250 million RP1 R&D Fab in Hillsboro, opened last year for researching 300-mm silicon wafer processing technologies.
Source: EE Times
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