Toshiba releases new Bluetooth components
Toshiba announced the new TC35654 integrated chipset for creating Bluetooth v1.1 interfaces. They include the RF path, ARM7TDMI core, signal normalization circuitry, buffer RAM and ROM firmware.
Unlike the previous developments, featuring the RF circuitry on bipolar transistors, the new RF circuitry is made using the CMOS technology. This enabled to pack the chip into the miniature 113-pin PFLGA (Plastic Fine-Pitch Land Grid Array) casing just 7x7x0.8 mm in size. The chip core features the technology licensed from Nokia, enabling the high-level compatibility with other Bluetooth platforms.
The 0.18-micron samples will arrive to the market in February 2003, the launch of volume production is expected in July. Initially, the company plans to ship up to 50,000 units per month to increase the number by the ten times in early 2004. The production is expected to feature the 0.13-micron process by that time.
Besides, today Toshiba started to ship the TB31296F Bluetooth RF path made using the SiGe Bi-CMOS technology.
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