Samsung SiP: a processor, NAND flash and SDRAM in a single package
Today Samsung Electronics announced a SiP (System-in-Package), including an ARM processor, NAND flash and SDRAM memory. Samsung believes new integrated SiP components, combining all the necessary things for PDAs or smartphones will enable to signficantly reduce energy consumption and cost price of such devices.
The new SiP chip doesn’t have a disclosed name at the moment. Measured 17x17x1.4 mm, the chip includes 203MHz Samsung S3C2410 processor on ARM920T core, 256Mbit NAND flash and 256Mbit SDRAM. The novelty can work under most PDA Oses, including Microsoft Windows CE, Palm OS, Symbian, and Linux.
For the first time Samsung will showcase the SiP component at the GSM World Congress Conference, that will take place on February 18-21 in Cannes, France.
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