HardwareZone posts IDF Spring 2003 Update Pt. 2
"The last vector of mobility is form factor. With improved heat exchanger technology, Intel is able to cool the Pentium-M processor using coolers with smaller form factors. This has enabled various manufacturers to release Centrino notebooks in very sleek form factors. At IDF, Intel showcased Centrino notebooks from vendors such as IBM, Samsung, Toshiba, Motion Computing, FIC, Gateway and ASUS. So far, Samsung had one of the best designs around, with a two spindle design thatís just about an inch thick."
Read more at HardwareZone!
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