More rumours: Prescott and Tejas of 2004 are to be packed into new bodies
British The Inquirer, referring to undisclosed industrial sources, reported that Intel’s future Prescott and Tejas will supposedly feature new LGA 775 packages (775-pin Land Grid Array). These are cheaper than usual PGA or BGA and allows for upgrade. Such technologies are already used by IBM, for example.
Some rumours regarding chipsets. Springdale and Canterwood, yet to be announced, will be replaced by Grantsdale with ICH6 Southbridge. 865G chipset will be replaced by Grantsdale-G; 865P and 865PE – by Grantsdale-P; 845GL/GV series – by Grantsdale GL.
Source: The Inquirer
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