Samsung 4-in-1: new MCP chips
Today Samsung Electronics launched volume production of new Multi-Chip Package (MCP) memory combining chips of 4 different types intended for new 2.5/3G mobile handsets.
Samsung´s new MCP chips include SDRAM, SRAM, UtRAM or NAND/NOR, two models were being announced today:
- RRNU6412864 of two 64Mbit NOR Flash chips, 128Mbit NAND Flash and 64Mbit UtRAM
- NUUS128643208 of 128Mbit NAND Flash, 64Mbit UtRAM, 32Mbit UtRAM and 8Mbit SRAM
New MCP products are 1.4mm thick (just 0.2mm more than usual.) But the compact layout resulted in 50% size reduction of MCP design in general.
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