Intel Ultra-Thin CSP: 5-layer chip-scale packaging
Intel announced a new CSP technology enabling 5-layer 1.2mm thick chips. At the same time the company announced 13 new products featuring this Ultra-Thin Stacked Chip-Scale Packaging (CSP). In Q3 we also should expect 1mm thick chips, 0.8mm appearing early next year.
The new Intel technology is designed for miniature components, especially mobile handsets, etc. currently Intel Ultra-Thin CSP is used for packaging 256Mbit StrataFlash chips. By the year-end, Intel plans to produce 512Mbit Ultra-Thin CSP, 1Gbit following in 2004. exceot fir Flash, such devices can combine SRAM, PSRAM or LP-SDRAM memory.
At the moment Intel controls about 20% of this market. Other players are Mitsubishi Electric, Sharp, Fujitsu, AMD, Samsung Electronics and Toshiba.
Source: EE Times
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