Hynix informs on plans for 0.1µm volume production
Hynix Semiconductor Inc. informed on plans to launch the volume production using the new Golden Chip (0.1µm) process.
The Korean maker intends to focus on 512Mbit DDR and DDR2 SDRAM chips, with 1Gbit DDR2 SDRAM scheduled to H2. According to Hynix, in 2003 about 20% of chips will be made using 0.1µm process, this value reaching 65% by 2004. Currently Hynix utilizes the Prime Chip process (0.13µm).
The company estimates the Golden Chip to reduce general investments by 50% (vs. competitors) and raise the wafer yield by 40% (vs. the Prime Chip).
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