Legacy Electronics patents its 3D chip assembly technology
North American Legacy Electronics, known as memory modules, PCB, etc. developer, maker and tester, obtained the patent No. 6,545,868 B1 from USPTO (United States Patent and Trademark Office) for the proprietary technology of assembling memory modules using Canopy assembly sub-modules (patent No. 6,313,998 B1).
The idea of using the Canopy tech is shown on the image above. It provides a kind of caps for making higher-capacity multi-layer memory modules like those the company produces now. The new technology will enable even higher-capacity 3D assembled modules for Legacy Electronics. Itís also interesting that initially this Canopy innovation was called to increase the stability and decrease the chance of overheating in multi-layer DRAM designs.
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