OCZ unveiled Copper BGA Ramsinks
OCZ Technology unveiled Copper BGA
Ramsinks, that are to be used for cooling down BGA memory and other small system
components. OCZ Copper BGA Ramsinks will be shipping in packs of four and include
thermal tape. Dimensions of the solution 16x13x9mm
The solution has been designed to provide optimal heat dissipation when used
on video card memory and small system components. We guess that such heat dissipators
will be widely used by overclockers.
Write a comment below. No registration needed!